Copper pyrophosphate CAS 10102-90-6

Copper pyrophosphate CAS 10102-90-6

Application Scenarios:

Electroplating Grade:

1. Electroplating of Metallized Through-holes in Printed Circuit Boards (PCBs): Copper pyrophosphate is a raw material for copper plating of deep holes and micro-blind holes in multilayer printed circuit boards (PCBs). The plating solution prepared with copper pyrophosphate and potassium pyrophosphate belongs to a complex electroplating system. It allows copper ions to be deposited extremely uniformly on the inner walls of deep holes and narrow slits, forming a uniform, dense, and pore-free plating layer. Simultaneously, this plating layer has high ductility, capable of withstanding the thermal expansion and contraction of the PCB board under the high temperatures of subsequent soldering without cracking, greatly improving the lifespan of electronic products and the stability of signal transmission.

2. Base (Thickening) Layer for Plastic Electroplating: Plastic surfaces (such as ABS plastic) cannot be directly electroplated. They need to be chemically plated with nickel (or copper) to make them conductive, and then a layer of copper pyrophosphate must be plated as a thickening base layer. The copper pyrophosphate plating layer is flexible and has extremely strong adhesion, perfectly buffering the thermal stress between the plastic and the external metal layer, preventing blistering or peeling on surfaces such as car logos and door handles.

3. Cyanide-free electroplating of complex hardware parts: Copper pyrophosphate, as an environmentally friendly cyanide-free electroplating solution, is widely used in the electroplating of complex artistic hardware, lighting fixtures, and locks, perfectly covering grooves and dead corners of the workpiece.

4. Rapid copper plating of high-strength steel wire: In the manufacture of steel cords for automobile tires, high-pressure hoses, and steel-cored aluminum stranded wires, the steel wires require high-speed continuous copper plating to enhance conductivity and corrosion resistance. Copper pyrophosphate electroplating allows operation at high current densities and has a fast deposition rate, making it ideal for such industrial production lines.

5. Localized anti-carburizing (anti-nitriding) isolation layer for mechanical parts: During surface heat treatment (carburizing or nitriding) of mechanical parts such as gears and bearings, certain areas that do not require hardening (such as threaded holes and shaft shoulders) can be pre-plated with a layer of copper pyrophosphate. This dense copper layer perfectly prevents the penetration of carbon and nitrogen atoms, and can be easily removed chemically after heat treatment.

Technical indicators:

Packaging:

Lined with polyethylene plastic bags and wrapped in composite plastic woven bags, with a net weight of 25 kilograms per bag