1. Electrolyte For Tin And Lead Free Plating In Electronics: Methanesulfonic acid tin plating has become the standard acid system for modern electroplating, so this stannous source is used in tin baths for connectors, terminals, PCB surface finishes and other lead free electronic coatings.
2. Solder Bump Plating For Wafer Level Packaging: Tin silver alloy solder bumps for flip chip interconnections are commonly prepared from methanesulfonic acid based baths, where the electrolyte offers high salt solubility and conductivity and dissolves the metals needed for co electrodeposition.
Factory Area
Standardized Process Flow
Production Capacity
Located in Shandong, our factory is approximately 300km from Qingdao Port, enabling fast and cost-effective delivery to customers worldwide.
Higher main content and lower impurity levels; batch-to-batch stability; better solubility, particle size, and flowability, facilitating downstream processes.
Quality system advantages:
Certification list - ISO 9001, REACH registration number, FDA, Kosher, Halal; each batch comes with a COA, supporting third-party testing (SGS, etc.); full traceability.
Supply chain advantages:
Own factory/integrated production; annual production capacity is at full capacity, with plans to expand production; some stock is available for immediate delivery; delivery time is clear.
Transportation
1
Packaging & Loading
25 kg bags with inner PE liner, 40 bags per pallet (1 MT), shrink-wrapped and fumigation-free; 20 MT per 20' FCL, 28 MT per 40' HQ.
2
Shipping
Sea freight is recommended for bulk orders (30–40 days to Europe/US); samples ship via DHL/FedEx within 3–7 days. Available terms: FOB Qingdao / CIF / DDP.
3
Dangerous goods
Classified as UN, Class, Packing Group; we provide full DG documentation and comply with IMDG for all ocean shipments.
4
Documents
Commercial invoice, packing list, bill of lading, COA, SDS, and certificate of origin are included with every shipment.