Industry Grade BISPHENOL A DIGLYCIDYL ETHER RESIN CAS 1675-54-3

Bisphenol A Epoxy Resin (DGEBA) — Product Detail Page

1. Product Overview

Bisphenol A epoxy resin (DGEBA, diglycidyl ether of bisphenol A) is the foundational epoxy resin of industry — the liquid or solid oligomer from which about 85% of the world's epoxy products are formulated. Its epoxide rings react with curing agents into dense, thermoset networks with outstanding adhesion, chemical resistance, mechanical strength and electrical insulation, properties that have made it indispensable from ship hulls to semiconductor packages.

The epoxy story is a story of DGEBA: heavy-duty anticorrosion coatings protect ships, bridges and pipelines; structural adhesives bond aircraft and automotive parts; glass- and carbon-fiber composites build wind-turbine blades and aerospace structures; copper-clad laminates carry printed-circuit boards; and encapsulants seal the chips inside every electronic device. One resin family, the backbone of modern materials engineering.

A single resin family, four core value propositions:

Coatings & Anticorrosion:

● the base resin of heavy-duty anticorrosion, floor and container coatings with outstanding chemical resistance;

Adhesives & Electronic Materials:

● the resin of structural adhesives, semiconductor encapsulants, insulating materials and copper-clad laminates;

Composites & Structural Materials:

● the matrix resin of wind-blade, carbon-fiber and glass-fiber composites with high strength and fatigue resistance;

Civil Engineering & Specialty:

● the resin of epoxy flooring, grouting, repair and specialty casting systems.

2. Product Information (Quick Facts)

3. Chemistry & Structure

DGEBA is produced by condensation of bisphenol A with epichlorohydrin, yielding an oligomer chain whose ends and repeating units carry reactive epoxide (oxirane) rings. The epoxide rings open in the presence of curing agents — amines (room-temperature cure), anhydrides or phenolic resins (heat cure) — cross-linking the molecules into a rigid, three-dimensional thermoset network. The cross-link density, set by the epoxy equivalent weight (EEW) and stoichiometry, controls the cured resin's glass-transition temperature, toughness and chemical resistance.

Commercial DGEBA is supplied in a continuum of molecular weights: low-EEW liquid resins (182 – 192 g/eq) for coatings, adhesives and composites; solid resins for powder coatings and high-performance systems; and solution or high-purity electronic grades for pre-pregs and encapsulation. Liquid, solid, solution and electronic grades are all available, with EEW, viscosity and impurity data documented on the COA.

4. Key Features & Benefits

● Superior adhesion: bonds strongly to metals, concrete, glass and composites — the benchmark structural adhesive chemistry.

● Outstanding chemical resistance: cured networks resist acids, alkalis, solvents, fuels and hydraulic fluids.

● Excellent mechanical and electrical properties: high strength, toughness and dielectric insulation for demanding service.

● Versatile cure chemistry: amines, anhydrides and phenolics give room-temperature to high-temperature cure options.

● Low shrinkage on cure: dimensional stability critical for coatings, adhesives and precision encapsulants.

● Broad grade range: liquid, solid, solution and electronic grades cover every major application market.

5. Main Applications

5.1 Coatings & Anticorrosion (Core Application)

DGEBA is the base resin of the anticorrosion coating industry:

● Heavy-duty anticorrosion: ship hulls, bridges, offshore structures, tanks and pipelines;

● Floor coatings: seamless, chemical-resistant epoxy flooring for industry, parking and food plants;

● Container and can coatings: internal linings resisting acids, foods and aggressive contents;

● Primers and e-coat: automotive and industrial primers and electrodeposition coatings.

5.2 Adhesives & Electronic Materials

● Structural adhesives: high-strength bonding in aerospace, automotive and general industry;

● Semiconductor encapsulation: molding compounds protecting chips and LEDs;

● Copper-clad laminates (CCL): resin matrix of PCB base materials;

● Electrical insulation: casting and impregnating systems for transformers, motors and switchgear.

5.3 Composites & Structural Materials

● Wind-turbine blades: matrix resin of glass-fiber blade structures with fatigue resistance;

● Carbon-fiber composites: prepreg and infusion resins for aerospace and sporting goods;

● Glass-fiber reinforced plastics (FRP): pipes, tanks, boats and structural profiles;

● Tooling and molds: dimensionally stable epoxy tooling systems.

5.4 Civil Engineering & Specialty Applications

● Epoxy flooring: seamless industrial and commercial floor systems;

● Grouting and anchoring: high-strength grouts and anchor adhesives;

● Concrete repair: bonding and crack-injection systems;

● Specialty casting: art resins, encapsulants and decorative systems.

6. Packaging, Storage

Packaging (customizable):

● Liquid: 20 kg HDPE pail, 200 kg drum, 1,000 L IBC, or ISO tank for bulk;

● Solid: 25 kg multi-wall bag or fiber drum; solution grades in drums;

● Electronic grade in sealed, clean containers.

Storage:

● Keep in a cool, dry, well-ventilated area away from direct sunlight and heat;

● Keep containers tightly closed — prevent moisture pick-up and contamination;

● Store away from oxidizers, acids, bases and curing agents (incompatible);

● Recommended storage temperature 5 °C – 35 °C; shelf life typically 12 – 24 months.

Why Choose Jinan Future Chemical Co., Ltd.?

● Factory-direct supply: own production capacity, transparent pricing, no middleman markup;

● Stable quality: strict internal control, every batch tested, COA with every shipment;

● Flexible specifications: liquid, solid, solution and electronic grades, custom packaging, sample orders welcome;

● Export experience: familiar with sea/air shipping documentation for chemical commodities, complete paperwork support;

● Fast response: quotations and technical support (COA, formulation advice) within 24 hours; small trial orders accepted.

FAQ

Q1: What is bisphenol A epoxy resin used for?

DGEBA is the base resin of about 85% of the world's epoxy products: heavy-duty anticorrosion coatings (ships, bridges, pipelines), structural adhesives, wind-turbine and carbon-fiber composites, semiconductor encapsulants, copper-clad laminates, and epoxy flooring and grouting systems.

Q2: Liquid, solid or solution — which grade should I buy?

Liquid resin (EEW 182 – 192) is the standard for coatings, adhesives, composites and casting. Solid resin (higher molecular weight) serves powder coatings and high-performance formulations. Solution grades are used for pre-pregs and processing, and electronic grade meets strict purity for encapsulation and laminates. The choice follows your curing system and application — specify them when ordering.

Q3: Does epoxy resin cure by itself?

No — DGEBA is a two-component system: it must be mixed with a curing agent (hardener) — amines for room-temperature cure, anhydrides or phenolic resins for heat cure — which opens the epoxide rings and cross-links the resin into the final thermoset. The resin-to-hardener ratio (stoichiometry) controls the cured properties, so always follow the formulation for your system.

Q4: Is bisphenol A epoxy resin safe to handle?

Uncured DGEBA is a skin sensitizer (may cause allergic skin reactions, H317) and harmful if swallowed; cured resin is inert and safe in service. Use gloves, goggles and adequate ventilation when handling the liquid, avoid skin contact, and keep it away from curing agents during storage. Bisphenol A is subject to food-contact restrictions in some markets