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| Synonyms:HFE-7100 Novec 7100 Equivalent Alternative Perfluoroisobutyl methyl ether Methyl nonafluoroisobutyl ether 1,1,2,3,3,3-Hexafluoro-1-methoxy-2-(trifluoromethyl)propane Molecular Formula:C₅H₃F₉O Molecular Weight: 250.06 HS Code: 2909199090 Grade: Industrial grade Cosmetic Grade Electronic high-purity grade8% Hazard Class:General Cargo | |||||||||
163702-08-7
Boss Chemical
163702-08-7
Methyl perfluoroisobutyl ether (also known as perfluorobutyl methyl ether, methoxy-nonafluorobutane) is one of the most important varieties in the hydrofluoroether (HFE) family. Trade names include HFE-7100, Novec 7100. It is a colourless, transparent liquid with a slight odour. It is used for various applications including cleaning agents to remove flux from mobile phone circuit boards, wafer drying medium for chip manufacturing, coolant for immersion liquid cooling in data centre servers and coating carrier for the lubricating layers of hard disc drive heads. Methyl perfluoroisobutyl ether is essential from the chips and circuit boards in mobile phones to the heat dissipation of cloud computing servers.
Basic identification information: Molecular formula C5H3F9O (structural formula C4F9OCH3), molecular weight 250.06, CAS number 163702-08-7 (The industrial product is a mixture of two inseparable isomers: methyl perfluoroisobutyl ether and methyl perfluoron-butyl ether; the other isomer has CAS number 163702-07-6). It is a type of fluorinated ether compound and an environmentally friendly engineering fluid that replaces ozone-depleting solvents such as CFC-113 and HCFC-141b.
Chemically, it possesses excellent chemical and thermal stability. It does not decompose or hydrolyze easily, is neutral and non-corrosive, and has low reactivity under normal use conditions. It has good material compatibility with metals (aluminium, copper, gold, steel, etc.), dielectric layers, plastics and elastomers. It is non-flammable (no flash point), non-ozone depleting (ODP=0), with a global warming potential of only 320, and an atmospheric lifetime of about 4.1 years, making it a low environmental impact solvent. Store in a sealed container, away from open flame and high-temperature heat sources to prevent volatilisation.
In terms of mechanism of action, methyl perfluoroisobutyl ether has an irreplaceable role, owing to the combination of “low surface tension penetration + rapid volatilisation without residue + chemical inert compatibility + non-conductive dielectric properties”. The mechanism of action in various applications is as follows:
1. Low surface tension penetration cleaning mechanism (13.6 dyn/cm) Its surface tension is much lower than water and most solvents. It can enter micron/submicron-level gaps and complex structures to dissolve grease, flux residues and particulate contaminants, so as to achieve deep cleaning of precision components and electronic devices.
2. Mechanism for rapid evaporation without residue due to low boiling point (61°C) It dries spotlessly, evaporating quickly and naturally after cleaning. With a moderate boiling point and high vapour pressure, it leaves no watermarks or solvent stains.
3. Drying principle of low miscibility and water displacement It has a high density and is poorly soluble in water. It can completely replace the water film on the surface of wafers and precision components with fluorinated liquid, and then it can quickly evaporate to realise watermark-free drying. This is the main drying mechanism after semiconductor wet processes.
4. Chemical inertness and material compatibility It is non-hydrolyzable, non-decomposable, neutral and non-corrosive. It is compatible with metals, dielectric layers, plastics and elastomers and can be used safely for cleaning, drying and coating of precision electronic devices and complex components without damaging the substrate.
5. Mechanism of dielectric property (non-conductive) It has a dielectric constant of about 7.4 and is non-conductive, so it can directly contact electronic devices and chips for cleaning and cooling without affecting electrical performance. This makes it a prerequisite for immersion liquid cooling and live cleaning.
6. Dissolution and film forming carrier mechanism (lubricating coating) It can dissolve fluorocarbon, hydrocarbon and silicon-based lubricants and act as a carrier to uniformly dilute and coat the lubricant onto precision surfaces. When the solvent evaporates, a uniform film is obtained, so that the precise and controllable lubrication coating is achieved at microgram level.
Application Field: Component manufacturing and electronic assembly
Corresponding Products: PCB (printed circuit board) flux cleaning, SMT (surface mount technology) assembly cleaning, BGA/flip chip package cleaning, connector and relay cleaning, sensor package cleaning, thyristor and power module assembly cleaning, semiconductor component flux removal, etc.
Applicability Principle: Its low surface tension enables it to penetrate micro-crevices to dissolve flux and grease, and its chemical inertness ensures no damage to solder joints and plastic packages and no residue after assembly. It is an environment-friendly electronic assembly cleaning agent to replace CFCs/HCFCs.
Application Field: Wafer processing and chip packaging
Corresponding Products: Post wet wafer cleaning, photoresist residue removal cleaning, post CMP (Chemical Mechanical Polishing) cleaning, post etching residue removal, wafer particle cleaning, pre packaging substrate cleaning, etc.
Applicability Principle: Low surface tension enables penetration into nano-scale circuit gaps to remove residues and particles; chemical inertness protects metal interconnects and dielectric layers from corrosion; ultra-low NVR and metal ion impurities guarantee wafer cleanliness after cleaning, which has a direct effect on chip yield.
Application Field: Optical manufacturing and optical communication
Corresponding Products: Camera lens cleaning, mobile phone camera module cleaning, fibre optic connector end-face cleaning, optical module internal cleaning, photodetector and laser packaging cleaning, optical prism and filter cleaning, image sensor cleaning, etc.
Applicability Principle: It has an extremely low surface tension allowing for perfect wetting and cleaning of optical and optoelectronic surfaces. Fast evaporation leaves no watermarks or streaks, does not damage coatings or precision structures, ensures the cleanliness of fibre optic end-faces and optical components, reduces optical loss, and improves transmission performance.
Application Field: Production of precision machinery and automotive components
Corresponding Products: Degreasing of engine blocks and pistons, cleaning of turbochargers, degreasing of transmission gears and bearings, cleaning of fuel injection components, cleaning of precision machine tool parts, degreasing of metalworking parts, etc.
Applicability Principle: Its strong penetrating and dissolving power removes processing grease and particles; it has good material compatibility and does not corrode metals; it produces no wastewater discharge, making it an ideal environmentally friendly degreasing solvent for automobiles and precision machinery.
Application Field: Semiconductors wet process, precision components drying
Corresponding Products: Wafer water replacement drying, post-dicing chip drying, substrate and package component drying, precision component cleaning & drying, MEMS structure drying, IPA (isopropanol) replacement drying process, anti-spot drying for electronic components, etc.
Applicability Principle: It is almost immiscible with water and has a high density, which allows it to completely replace the water film on wafer and component surfaces with a fluorinated liquid which then evaporates quickly, resulting in spotless and watermark-free drying and avoiding watermarks and oxidation. It is an important drying medium in semiconductor and precision manufacturing.
Application Field: Manufacturing of MEMS and microsensors
Corresponding Products: Drying for the release process of MEMS accelerometers, gyroscopes, microphones, anti-stiction treatment after removal of sacrificial layer, cleaning of wafer level packaging of microstructures, manufacturing of micro-relays and micro-pumps, drying of bio-microfluidic chips, etc
Applicability Principle: Its extremely low surface tension prevents microstructures from collapsing via capillary adhesion during liquid drying. It is a key medium for post-processing in MEMS release processes because it evaporates rapidly and does not leave residues on the surface, enabling free release of microstructures.
Application Field: Surface Coating, Precision Lubrication
Corresponding Products: Hard disc drive head/platter lubrication coating, precision bearing & gear lubrication carrier, MEMS device lubrication, relay & switch contact lubrication coating, optical drive & precision mechanism lubrication, fluorocarbon/hydrocarbon/silicon-based lubricant dilution coating, mould release coating carrier, etc.
Applicability Principle: It can dissolve fluorocarbon, hydrocarbon and silicon-based lubricants and acts as a carrier for uniform coating. After the evaporation of the solvent, a uniform thin film is formed, which can realise microgram-level precise and controllable lubrication coating, which is crucial to the long-term reliable operation of hard drives and precision mechanisms.
Application Field: Data centre and cloud computing cooling
Corresponding Products: Server single phase immersion liquid coolant, high density computing node coolant, AI computing server liquid cooling, super computer liquid cooling, edge data centre cooling medium, energy storage system thermal management fluid, etc.
Applicability Principle: It is non-conductive and can be used to immerse powered servers for safe cooling; boiling point 61℃; supports single-phase and two-phase cooling; chemically inert and does not corrode electronic components; low GWP meets data centre green compliance requirements; it is currently the mainstream single-phase immersion liquid cooling medium.
Application Field: Thermal management of power electronics and semiconductor equipment
Corresponding Products: Power semiconductor device (IGBT, SiC/GaN module) cooling, 5G base station RF device heat dissipation, optical module thermal management, semiconductor etching / thin film equipment cooling, new energy vehicle electronic control and charging pile thermal management fluids, high-precision thermal management system heat transfer media, etc.
Applicability Principle: This material is non-conductive, chemically inert, has moderate boiling point and controllable vapour pressure. It can directly contact high voltage, high power devices to efficiently remove heat without affecting electrical performance, which makes it a reliable medium for thermal management of power electronics and semiconductor equipment.
Application Field: Organofluorine chemistry, Fine chemical industry
Corresponding Products: Reactor media for the synthesis of organofluorine compounds, polymerisation solvents, dispersants for fluorinated monomers, extraction and separation media, carrier liquids for fluorination reactions, diluents for special coatings, etc.
Applicability Principle: It is chemically inert and does not participate in the reaction, thermally stable and not easily decomposed, with good solubility for fluorides. It provides a safe and inert reaction environment for fluorine chemical synthesis and is a commonly used medium for the preparation of fluorinated fine chemicals.
Application Field: Aerosol, electronic equipment maintenance
Corresponding Products: Industrial spray cleaner, live-line spray cleaner for electronic equipment, online cleaner for server room, online cleaner for communication equipment, electronic control cabinet cleaning spray, precision instrument dust removal spray, aerosol propellant replacement system, release spray carrier, etc.
Applicability Principle: It is non-conductive so you can clean powered electronic equipment without causing short circuits. It is odourless, fast evaporating, non-toxic and non-flammable, safe and environmentally friendly. It is a safe alternative to conventional flammable propellants used for maintenance of server rooms and online cleaning of electronic equipment.
Application Field: Analytical testing, Electronic testing
Corresponding Products: Dielectric constant test liquid, density gradient test medium, electronic device leak detection liquid, particle size detection suspension medium, failure analysis decapsulation cleaning liquid, electronic test fixture cleaning liquid, semiconductor wafer test medium, high-precision instrument maintenance cleaning liquid, etc.
Applicability Principle: It has stable dielectric properties, chemical inertness and non-corrosiveness, suitable as an electrical testing medium and leak detection fluid. Test results are accurate due to electronic-grade high purity. In failure analysis, it can remove encapsulation materials safely without damaging the chip structure.
Application Field: Cosmetics and daily chemical products Corresponding
Products: Bubble masks/oxygen bubble masks, facial foams, volatile skin feel modifiers, carriers for refreshing skin care formulas, volatile carriers for makeup formulas, carriers for hair care products, etc.
Applicability Principle: With low boiling point (61℃) and high vapour pressure, when applied on the skin, it vaporises quickly with the body temperature and forms minuscule bubbles, which create the foaming effect of a bubble mask and a cooling sensation. It is non-greasy and leaves no residue after evaporation. It can be used as a volatile carrier to adjust the skin feel of the formula (cosmetics must be cosmetic grade and follow PFAS regulations).
To summarise, methyl perfluoroisobutyl ether (CAS 163702-08-7/163702-07-6, trade names HFE-7100, Novec 7100) is an "environmentally friendly precision manufacturing engineering fluid". It has mature applications in multiple major sectors, including electronic component and PCB cleaning, semiconductor wafer cleaning, optical and optical communication cleaning, precision machinery and automotive degreasing, water displacement drying, MEMS manufacturing, lubrication coating, data centre immersion liquid cooling, power electronics thermal management, reaction media, aerosol carriers, detection and analysis, and cosmetic bubble masks. Benefiting from its low surface tension penetration, rapid evaporation without residue, water displacement drying and chemical inertness compatibility, among these fields, electronic precision cleaning, semiconductor wafer drying and data centre immersion liquid cooling are currently the fastest growing areas, which are widely used in the manufacturing and heat dissipation of electronic devices such as mobile phones, computers and servers.